FPGA可编程逻辑器件芯片XC6VSX475T-1FFG1156I中文规格书

7 Series FPGAs Packaging

UG475 (v1.18) July 16, 2019XC7VX690T and XQ7VX690T Banks

Figure 1-24 shows the I/O and transceiver banks for the XC7VX690T and XQ7VX690T.FFG1157 and RF1157 Packages

HP I/O banks 10, 11, 12, 13, 30, 31, 32, and 33 are not bonded out.•GTH Quads 110, 111, 112, 113, 119, 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219are not bonded out.

FFG1158 and RF1158 Packages

HP I/O banks 10, 11, 12, 13, 18, 19, 30, 31, 32, 33, 37, 38, and 39 are not bonded out.•GTH Quads 110, 111, 112, 113, 210, 211, 212, and 213 are not bonded out.

FFG1761 and RF1761 Packages

HP I/O banks 10, 11, and 30 are not bonded out.•GTH Quads 110, 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 are not bonded out.

FFG1926 Package

HP I/O bank 17 is partially bonded out.•

HP I/O banks 18, 19, 37, 38, and 39 are not bonded out.•GTH Quads 110, 119, 210, and 219 are not bonded out.

FFG1927 Package

HP I/O banks 10, 11, 12, 13, 30, 31, 32, and 33 are not bonded out.•All GTH Quads are fully bonded out in this package.

FFG1930 and RF1930 Packages

All HP I/O banks are fully bonded out in these packages.•GTH Quads 110, 111, 112, 119, 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 are

FPGA可编程逻辑器件芯片XC6VSX475T-1FFG1156I中文规格书

not bonded out.

FPGA可编程逻辑器件芯片XC6VSX475T 1FFG1156I中文规格书相关文档

最新文档

返回顶部